TSMC

November 12, 2014

TSMC begins risk production of 16FF+

TSMC says it has begun risk production on its FinFET Plus (16FF+) process, claiming that it has reached a greater level of maturity earlier in its development cycle than previous nodes developed at the foundry.
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November 12, 2014

Chip tariff eliminated and the big winner is… China?

Not just Intel and TI but also Lenovo and Huawei have cause to welcome end to 25% import tax. And could it even help reinvigorate Chinese start ups?
September 29, 2014

TSMC adds sub-micron low-leakage processes

TSMC has launched three processes the foundry is aiming at internet-of-things (IoT) and wearable-device designs, providing lower-leakage versions of its 55nm, 40nm and 28nm processes.
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September 11, 2014

TSMC: e-beam winning on cost over EUV for lithography

EUV may be getting most R&D cash but the world's biggest foundry says e-beam currently has the edge on defects and double patterning.
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July 15, 2014

Cadence targets finFETs with RC extraction speedup

Cadence has launched a parasitic-extraction tool that takes better advantage of multiple computers and which has been certified for TSMC's 16nm finFET process.
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July 4, 2014

Qualcomm takes 28nm to China in SMIC deal

Chinese foundry Semiconductor Manufacturing International Corporation (SMIC) is to get a helping hand to develop a production-class 28nm process from Qualcomm Technologies.
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June 5, 2014

Cliff Hou, TSMC VP R&D, on the route to 10nm – and beyond

Head of TSMC R&D talks about what it will take to develop and use 10nm, 7nm processes, and a possible shift to using packaging to extend Moore's law scaling
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June 3, 2014

Remember 20nm? Qualcomm does

Qualcomm will present at VLSI Technology Symposium 2014 a version of TSMC's 20nm technology that uses design and process tweaks to reduce the number of double-patterned layers.
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April 16, 2014

FinFET variability issues challenge advantages of new process

Managing finFET variability issues without extending design times is key to extracting the most from the new processes, key players told a panel at the recent SNUG meeting in Santa Clara.
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March 27, 2014

Intel and Altera extend foundry deal into interposer and full 3D

Deal quashes rumors that Altera was about to move its cutting edge production back to TSMC, but nor does it appear to be 'exclusive' for 3D products.
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