September 12, 2017
ARM, Xilinx, Cadence Design Systems, and TSMC have agreed to produce a test chip for the CCIX project.
June 18, 2017
TSMC encapsulated the multiple chips assembled on a 1200mm2 silicon substrate to cut the chance of damage from warping with the company's CoWoS2 SiP technology.
June 1, 2017
Synopsys has released details on its varied activities at DAC 2017, ranging from panels to technical papers.
February 21, 2017
Xilinx plans to add high-speed analog interfaces to its upcoming FPGAs to better support high-density 5G basestation designs.
January 18, 2017
What's old is new: 200mm wafers are returning and driving shortages while 450mm fades into the distance.
May 18, 2016
ARM says it has received test chips designed to check how well an SoC built around a 64bit multicore Cortex v8-A processor complex would work TSMC's upcoming 10nm FinFET process technology.
April 7, 2016
But project lead Chenming Hu, 'finFET's father', has also highlighted important changes in the funding landscape for university research.
September 14, 2015
Menta has launched a family of off-the-shelf IP cores aimed at TSMC’s 28nm processes to provide reconfigurability for SoCs.
July 30, 2015
Collaboration between ARM, TSMC and Synopsys reveals challenges of 10nm finFET design flows.
July 9, 2015
IBM, GlobalFoundries, Samsung and SUNY deserve kudos for manufacturing the first 7nm chip but the NREs involved still look frightening.