Xilinx plans to add high-speed analog interfaces to its upcoming FPGAs to better support high-density 5G basestation designs.
What's old is new: 200mm wafers are returning and driving shortages while 450mm fades into the distance.
ARM says it has received test chips designed to check how well an SoC built around a 64bit multicore Cortex v8-A processor complex would work TSMC's upcoming 10nm FinFET process technology.
But project lead Chenming Hu, 'finFET's father', has also highlighted important changes in the funding landscape for university research.
Menta has launched a family of off-the-shelf IP cores aimed at TSMC’s 28nm processes to provide reconfigurability for SoCs.
Collaboration between ARM, TSMC and Synopsys reveals challenges of 10nm finFET design flows.
IBM, GlobalFoundries, Samsung and SUNY deserve kudos for manufacturing the first 7nm chip but the NREs involved still look frightening.
Foundry strikes two more Internet of Things subsystem deals for its 55nm ULP process based on Cadence Tensilica and Imagination MIPS/PowerVR cores.
It wasn't just ARM and TSMC that launched a 55nm IoT platform this week. Across the Taiwan Strait, Brite and SMIC have unveiled a similar offering. The competition could tell us a lot about the IoT market's future.
The International Electron Device Meeting (IEDM) has once again provided a chance for the major chipmakers to go head-to-head with their latest processes - this time with finFETs.
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