TSMC

January 18, 2017

Wafer expansion hits the buffers

What's old is new: 200mm wafers are returning and driving shortages while 450mm fades into the distance.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , ,   |  Organizations: ,
May 18, 2016

ARM completes multicore test chip on 10nm finFET

ARM says it has received test chips designed to check how well an SoC built around a 64bit multicore Cortex v8-A processor complex would work TSMC's upcoming 10nm FinFET process technology.
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April 7, 2016

SNUG 2016: Intel, TSMC, GloFo back post-finFET research at UC Berkeley

But project lead Chenming Hu, 'finFET's father', has also highlighted important changes in the funding landscape for university research.
September 14, 2015

Menta aims for TSMC 28nm with embedded FPGA cores

Menta has launched a family of off-the-shelf IP cores aimed at TSMC’s 28nm processes to provide reconfigurability for SoCs.
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July 30, 2015

10nm flow reveals complexity of finFET design process

Collaboration between ARM, TSMC and Synopsys reveals challenges of 10nm finFET design flows.
Article  |  Topics: Conferences, Design to Silicon, Blog - EDA  |  Tags: , , , , , ,   |  Organizations: , ,
July 9, 2015

IBM and friends at 7nm: breakthrough or science project?

IBM, GlobalFoundries, Samsung and SUNY deserve kudos for manufacturing the first 7nm chip but the NREs involved still look frightening.
June 10, 2015

TSMC adds Cadence and Imagination subsystems for IoT

Foundry strikes two more Internet of Things subsystem deals for its 55nm ULP process based on Cadence Tensilica and Imagination MIPS/PowerVR cores.
June 4, 2015

COMPUTEX 2015: Taiwan and mainland China face off in IoT platforms

It wasn't just ARM and TSMC that launched a 55nm IoT platform this week. Across the Taiwan Strait, Brite and SMIC have unveiled a similar offering. The competition could tell us a lot about the IoT market's future.
December 16, 2014

14nm/16nm finFETs debut at IEDM

The International Electron Device Meeting (IEDM) has once again provided a chance for the major chipmakers to go head-to-head with their latest processes - this time with finFETs.
Article  |  Topics: Blog - EDA  |  Tags: , ,   |  Organizations: , ,
November 12, 2014

TSMC begins risk production of 16FF+

TSMC says it has begun risk production on its FinFET Plus (16FF+) process, claiming that it has reached a greater level of maturity earlier in its development cycle than previous nodes developed at the foundry.
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