Rapid virtual prototyping and a metal stack that's more designer friendly are two of the ways in which Samsung aims to build up foundry market share for its 14nm and 10nm finFET processes.
IBM, GlobalFoundries, Samsung and SUNY deserve kudos for manufacturing the first 7nm chip but the NREs involved still look frightening.
Are we torn between evolution and revolution? Mentor Graphics' Joe Sawicki discusses how pattern matching already in fabs could move up and radically alter the design flow.
Manufacturing giant says we need a new category of WPUs - wearables processing units - to create a mass market and that ARM needs to go smaller than the MO.
Samsung, Synopsys and ARM have been working together to create a finFET design ecosystem.
Cadence Design Systems has developed two sets of IP aimed at the 28nm FD-SOI process developed by STMicroelectronics and qualified tools for the process.
STMicroelectronics has found an alternative production partner for the FD-SOI process that the European chipmaker is presenting as an easier option for SoC designers.
But some research and process collaboration is set to continue in the background as Samsung, GlobalFoundries and IBM chart their own priorities.
TSMC stays the course with new co-CEOs as Morris Chang retains executive leadership for now while finFET, 3D and other new technologies settle in.
Packed one-day event has speakers from Cadence, TSMC, Samsung, Amkor, Advantest and more providing a senior level view of making 3D-IC a reality. Registration closes soon.
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