Samsung Electronics

July 28, 2015

Samsung applies early prediction and color management to 10nm plans

Rapid virtual prototyping and a metal stack that's more designer friendly are two of the ways in which Samsung aims to build up foundry market share for its 14nm and 10nm finFET processes.
July 9, 2015

IBM and friends at 7nm: breakthrough or science project?

IBM, GlobalFoundries, Samsung and SUNY deserve kudos for manufacturing the first 7nm chip but the NREs involved still look frightening.
November 4, 2014

From Darwin to Mao: how multi-patterning could move up the flow

Are we torn between evolution and revolution? Mentor Graphics' Joe Sawicki discusses how pattern matching already in fabs could move up and radically alter the design flow.
September 10, 2014

Foxconn’s wishlist for wearables and the Internet of Things

Manufacturing giant says we need a new category of WPUs - wearables processing units - to create a mass market and that ARM needs to go smaller than the MO.
June 2, 2014

Samsung certifies Synopsys tools, IP at 14nm

Samsung, Synopsys and ARM have been working together to create a finFET design ecosystem.
Article  |  Topics: Conferences, Design to Silicon, Blog - IP  |  Tags: ,   |  Organizations: , ,
May 17, 2014

Cadence ports IP and qualifies tools for 28nm FD-SOI

Cadence Design Systems has developed two sets of IP aimed at the 28nm FD-SOI process developed by STMicroelectronics and qualified tools for the process.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , ,   |  Organizations: , ,
May 14, 2014

Samsung agrees to make 28nm FD-SOI

STMicroelectronics has found an alternative production partner for the FD-SOI process that the European chipmaker is presenting as an easier option for SoC designers.
Article  |  Topics: Blog - EDA  |  Tags: ,   |  Organizations: , ,
April 15, 2014

Common Platform foundry alliance to be wound down

But some research and process collaboration is set to continue in the background as Samsung, GlobalFoundries and IBM chart their own priorities.
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations: , , ,
November 13, 2013

TSMC succession plan emphasizes stability

TSMC stays the course with new co-CEOs as Morris Chang retains executive leadership for now while finFET, 3D and other new technologies settle in.
Article  |  Topics: Commentary, Design to Silicon  |  Tags: , , , , , , , ,   |  Organizations: , , ,
October 23, 2013

3D-IC focus for GSA’s Taipei Memory+ event next week

Packed one-day event has speakers from Cadence, TSMC, Samsung, Amkor, Advantest and more providing a senior level view of making 3D-IC a reality. Registration closes soon.

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