DAC 2021 Preview: Siemens EDA
DAC 2021 is looming and here is our first round up of a major EDA player's plans for the physical event in San Francisco.
GDSII
Case study: Achieving earlier signoff convergence and a ‘shift left’ for P&R at Qualcomm
Qualcomm has described its use of Calibre RealTime Digital to enhance its P&R flow.
Imagination sells design services, software integration to Sondrel
Engineering consultancy pays undisclosed sum for IMGworks division.
Open-Silicon claims RISC-V ultra-low-power first
Implementation uses dedicated PULP technology in silicon for Green Waves Technologies on TSMC's 55nm LP process.
DAC 2016 preview: Mentor Graphics
An overview of the vendor's busy DAC program from panels to technical sessions to a one-to-one with Wally Rhines.
User2User preview: Silicon Valley edition rolls out this month
Companies presenting at User2User Santa Clara on April 26 include AMD, Microsoft, nVidia, Oracle, Qualcomm, and Samsung.
Gary Smith EDA: PCB ‘a door to the future’ but ‘slow take-off’ for ESL
The leading EDA analyst also charts growth for RTL and IC CAD in 2014 Market Share Summary, and highlights system-driven shifts in tool evaluation.
eSilicon to cut costs of ASIC development for IoT, other markets
Online portals enable ASIC designers to explore IP and delivery options, enabling lower-cost markets such as IoT
CDN Live: Cadence’s Encounter revamp collates innovation
Performance boost claimed from streamlining optimization across synthesis and layout using modeling, novel CTS strategy and 20nm-ready features.
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