Tech Design Forum
Briefing
structured test
structured test
April 13, 2016
User2User preview: Silicon Valley edition rolls out this month
Companies presenting at User2User Santa Clara on April 26 include AMD, Microsoft, nVidia, Oracle, Qualcomm, and Samsung.
Article | Topics:
Conferences
,
Design to Silicon
,
Digital/analog implementation
,
Blog - EDA
,
- GDSII
,
Blog - PCB
,
- RTL
,
Tested Component to System
,
Verification
| Tags:
emulation
,
fill
,
floorplanning
,
formal verification
,
multi-die package
,
portable stimulus
,
structured test
| Organizations:
AMD
,
Arm
,
Mentor Graphics
,
Micron Technology
,
Microsemi
,
Microsoft
,
nVidia
,
Oracle
,
Qualcomm
,
Samsung Electronics
,
User2User
,
Xilinx
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