February 6, 2013
GlobalFoundries has signed deals to let the foundry offer power-saving clocks, a massively parallel floating-point processor and interface IP from Rambus. They are "uncommon solutions" to come from a foundry, the company claims.
February 5, 2013
GlobalFoundries and Samsung described how they are readying finFETs for production at CPTF 2013 and how the 28nm processes will have a long shelf life.
December 13, 2012
3D-IC integration techniques such as the use of TSVs, die stacking and interposers are unlikely to limit performance, according to research from TSMC and IBM
December 11, 2012
Can planar devices on fully depleted SOI resist the relentless rise of finFETs as the next device architecture of choice for the semiconductor industry? An evening panel at IEDM explored the trade-offs
December 10, 2012
The modelling track at IEDM 2012 showed how germanium could be used in 14nm finFETs. Other work focused on tunnel FETs and analyzing MEMS using Spice.
October 18, 2012
STMicroelectronics offers 28nm process to smaller scale users through CMP and Soitec
October 16, 2012
IP and EDA vendors line up to support TSMC 20nm process, CoWoS 3DIC technology
October 11, 2012
Intel finFET family grows to support SoC use, as TSMC boosts p-channel performance with germanium
October 9, 2012
TSMC has released two reference flows – one for its 20nm and the other for the form of 3D integration favored by the Taiwanese foundry, chip on wafer on substrate (CoWoS).
October 9, 2012
With the foundry giant set to take the wraps off its latest flows and innovations in just seven days, remember that you must pre-register to attend its Silicon Valley event. Also here are some pre-event pointers.