Chipmaker

Siemens introduces mPower to bridge the analog-to-digital gap in IR-drop and EM analysis, reflecting the scaling trends in today's ICs.

Siemens EDA has become the first of the major EDA vendors to join the DARPA Toolbox Initiative.

A DVCon technical paper addresses potential reset domain crossing metastability issues due to UPF instrumentation.

STMicroelectronics has made its first silicon carbide wafers that can be run on a 200mm line.

Arm and flexible-electronics specialist PragmatIC have demonstrated a 32bit processor implemented on a plastic substrate.

Building products using chiplets involves more than treating them as hard IP cores. Many open questions surround the field, explored by panelists in a MEPTEC conference online.

Samsung described at VLSI Symposia how it has used two further forms of stacking to increase flash capacity.

Xilinx has reworked its Versal FPGA for edge-AI applications.

Questa suite of VIP adds PC and enterprise protocol as players prep designs for 2023 release.

Arm is reworking the DesignStart scheme it introduced several years, moving it under the umbrella of the broader Flexible Access program.