Archives

October 6, 2023

Fast instruction simulator expands to Arm

MachineWare has expanded its portfolio of high-speed instruction-set simulators to the Arm Cortex-A and -M architectures.
Article  |  Topics: Blog - EDA, Embedded  |  Tags: , , , , ,   |  Organizations:
October 5, 2023

Vertical integration expands at IEDM

Vertical integration is one of the major focus areas at the upcoming IEDM conference, both in terms of transistors and the multiple channels that will go into them.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , ,   |  Organizations: , ,
September 28, 2023

Shift left: what it does and how to make it happen

Get to know more on the specific benefits of shift left and how to achieve easy adoption.
September 20, 2023

AI aims to cut CAD-model generation time

Ultra Librarian has developed an AI-driven CAD modeling engine that should slash the the time it takes to build component and subsystem models for PCB layout and system design.
Article  |  Topics: Blog - PCB  |  Tags: , , ,   |  Organizations:
September 14, 2023

Cadence gives OrCAD access to cloud AI placement

Cadence has given its new release of OrCAD access to the cloud-based AI placer designed for its Allegro PCB-layout software.
Article  |  Topics: Blog - PCB  |  Tags: , ,   |  Organizations:
September 6, 2023

HPC and AI provide keynote focus at DVCon Europe

DVCon Europe has announced its two keynote presentations, focusing on energy-efficient high-performance computing and machine learning.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , , ,   |  Organizations: ,
August 22, 2023

Accellera group formed to work on federated simulation

Accellera has formed a working group to look at the possibility of creating a standard for federated simulation.
August 8, 2023

Catch up with the state-of-the-art in ‘shift left’

Just how much of the flow has already has 'shift left' benefit and what is fueling further progress.
July 25, 2023

Verification Futures heads to the US in September

Tessolve is bringing its Verification Futures conference to the US with an event scheduled for mid-September.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , ,   |  Organizations: , , ,
July 24, 2023

Backside power shows promise but more complex manufacturing

Backside power delivery could lead to improvements in chip density and more straightforward place-and-route phases according to work presented at this year’s VLSI Symposium.
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations: , ,