Imec cleans up process for 2µm-pitch 3DIC stacks
Imec has developed cleaner techniques for preparing die-to-wafer bonding components for high-density logic-memory stacks and optical integration.
wafer bonding
Backside power shows promise but more complex manufacturing
Backside power delivery could lead to improvements in chip density and more straightforward place-and-route phases according to work presented at this year’s VLSI Symposium.