Archives

July 20, 2023

Ferroelectric memory moves closer with VLSI experiments

Ferroelectric memory may be able to stage a comeback thanks to materials innovations as work presented at VLSI Symposium have shown, though there is still plenty to do.
July 14, 2023

Cadence mixes know-how and AI to bridge RTL gap

The Joules RTL Design Studio aims to make coding more aware of aware of physical issues before and after hand-off for implementation.
Article  |  Topics: Blog Topics, Physical design, RTL, Verification  |  Tags: , , , , ,   |  Organizations: , , ,
July 12, 2023

‘Two wafers are better than one’ for 3D flash

Western Digital's head of technology set out at the recent VLSI Symposium the ways in which flash makers can scale without costs accelerating.
Article  |  Topics: Blog - IP  |  Tags: , , ,   |  Organizations: ,
July 11, 2023

AI’s possible roles in verification covered at VF2023

The recent Verification Futures Europe conference looked at what AI, from decision trees to foundation models, could do to speed up RTL checks.
July 10, 2023

Calibre ‘shifts left’ into place and route

Calibre Design Enhancer moves physical verification checks and automated DRC-clean via and cell insertion into P&R
Article  |  Topics: DFM, Digital/analog implementation, Blog - EDA, - Verification  |  Tags: , , ,   |  Organizations: ,
July 10, 2023

Siemens fuels custom IC flows with artificial intelligence

Three fast developing AI techniques underpin the efficiencies in the new Solido custom design and verification platform.
July 7, 2023

UK consortium tapes out cryo-SRAM

A UK cryogenic-CMOS research project has taped out its first demonstrator chip for core memory IP expected to be able to operate at close to absolute zero.
Article  |  Topics: Blog - IP  |  Tags: , , ,   |  Organizations:
July 4, 2023

Co-design underpins infrastructure acceleration at Google

At the recent VLSI Symposium, Google vice president Parthasarathy Ranganathan described the importance of co-design and the software stack in its data-center designs.
June 22, 2023

IEDM looks for leading devices for upcoming conference

The 69th annual IEEE IEDM has issued a call for papers seeking the world’s best original work in all areas of microelectronics research and development.
Article  |  Topics: Blog - IP  |  Tags: , ,   |  Organizations:
June 20, 2023

Maximize manufacturing execution with HPC

Single-device tracking in the chiplet and multi-chip age needs a boost to deliver accuracy and greater production efficiency.