Tech Design Forum
Briefing
bonded wafers
bonded wafers
May 29, 2024
Imec cleans up process for 2µm-pitch 3DIC stacks
Imec has developed cleaner techniques for preparing die-to-wafer bonding components for high-density logic-memory stacks and optical integration.
Article | Topics:
Blog - IP
| Tags:
3DIC
,
bonded wafers
,
silicon photonics
,
wafer bonding
| Organizations:
IMEC
July 12, 2023
‘Two wafers are better than one’ for 3D flash
Western Digital's head of technology set out at the recent VLSI Symposium the ways in which flash makers can scale without costs accelerating.
Article | Topics:
Blog - IP
| Tags:
bonded wafers
,
flash
,
heterogeneous processing
,
monolithic 3DIC
| Organizations:
Kioxia
,
Western Digital
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