bonded wafers


May 29, 2024

Imec cleans up process for 2µm-pitch 3DIC stacks

Imec has developed cleaner techniques for preparing die-to-wafer bonding components for high-density logic-memory stacks and optical integration.
Article  |  Topics: Blog - IP  |  Tags: , , ,   |  Organizations:
July 12, 2023

‘Two wafers are better than one’ for 3D flash

Western Digital's head of technology set out at the recent VLSI Symposium the ways in which flash makers can scale without costs accelerating.
Article  |  Topics: Blog - IP  |  Tags: , , ,   |  Organizations: ,

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