Siemens agrees deal to buy Mentor Graphics
German industrial conglomerate to pay $4.5B to extend its PLM division into electronic chip and systems design.
Commentary
Computex 2016: Microsoft makes play to be the VR OS
Microsoft has launched an OEM version of the Windows Holographic platform it has developed for its own AR headset, the HoloLens.
SNUG 2016: Intel, TSMC, GloFo back post-finFET research at UC Berkeley
But project lead Chenming Hu, 'finFET's father', has also highlighted important changes in the funding landscape for university research.
GSA on how to reinvigorate silicon business models
Open-source hardware, in-field configurability, and a hardware-plus-services approach could protect margins as the IoT hammers down costs, says GSA report.
Accellera and Mentor’s Dennis Brophy talks standards targets and DVCon
Driving down energy consumption for the IoT, making portable stimulus deliver real benefits and the practical benefts of a globalizing DVCon.
DVCon Europe: UVM-SystemC backers ready first draft
But the bridge standard's European backers still need greater support from the big EDA vendors.
Mentor’s Wally Rhines on M&A ‘merger mania’
...and why the semiconductor industry hasn't been singularitied down to one MegaSemis Inc even if that's what M&A data suggests.
IBM and friends at 7nm: breakthrough or science project?
IBM, GlobalFoundries, Samsung and SUNY deserve kudos for manufacturing the first 7nm chip but the NREs involved still look frightening.
Remembering Gary Smith
The leading EDA analyst passed away late last week after a short illness. Graham Bell offers this remembrance.
TSMC adds Cadence and Imagination subsystems for IoT
Foundry strikes two more Internet of Things subsystem deals for its 55nm ULP process based on Cadence Tensilica and Imagination MIPS/PowerVR cores.
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