TSMC adds Cadence and Imagination subsystems for IoT
Foundry strikes two more Internet of Things subsystem deals for its 55nm ULP process based on Cadence Tensilica and Imagination MIPS/PowerVR cores.
55nm
COMPUTEX 2015: Taiwan and mainland China face off in IoT platforms
It wasn't just ARM and TSMC that launched a 55nm IoT platform this week. Across the Taiwan Strait, Brite and SMIC have unveiled a similar offering. The competition could tell us a lot about the IoT market's future.
The changes demanded by IoT design
Does the internet of things (IoT) require a change in design techniques? A number of people involved in the EDA industry reckon it does.
Altera moves to 55nm for non-volatile programmable logic
Altera has moved to a 55nm embedded flash process to continue its Max series of non-volatile FPGAs.
TSMC adds sub-micron low-leakage processes
TSMC has launched three processes the foundry is aiming at internet-of-things (IoT) and wearable-device designs, providing lower-leakage versions of its 55nm, 40nm and 28nm processes.
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