Commentary

Building the internet of Things will demand collaboration and a healthy ecosystem

Verify early and simulate as little as possible - the idea is familiar but how do you get there?

Whether you're going to DAC this week or not, it's worth remembering one of the other key factors that will inform your judgments on new tools.

The first in a series of articles on how various vendors are addressing the flow's most challenging task looks at Mentor's strategy for emulation.

EDA giant cites high-level synthesis' move into the mainstream as driven by IP integration challenges in striking deal for the HLS market leader.

Glass may be the high frequency interposer option given silicon concerns about power and noise. TSMC adds another pathfinder to its 3D arsenal.

Industry-wide innovation is required to make scaling cost-effective at 7nm, says Qualcomm's VP of Technology. Time for a fat, cholesterol and MSG-free diet.

A leading researcher argues that graphene will not replace but complement silicon and thrive in specialist applications.

TSMC stays the course with new co-CEOs as Morris Chang retains executive leadership for now while finFET, 3D and other new technologies settle in.

Research projects to verify methodologies, address third-party integration challenges and add a low-cost interposer-like technology to the 3D-IC family make their mark.