Brite Semiconductor

June 10, 2015

TSMC adds Cadence and Imagination subsystems for IoT

Foundry strikes two more Internet of Things subsystem deals for its 55nm ULP process based on Cadence Tensilica and Imagination MIPS/PowerVR cores.

Article | Topics: Commentary, Digital/analog implementation, Blog - EDA, Embedded, IP | Tags: 28nm, 40nm, 55nm, DAC 2015, DSP, internet of things, MCU, MIPS, peripheral, PowerVR, subsystem, Tensilica, ULP | Organizations: Arm, Brite Semiconductor, Cadence Design Systems, Imagination Technologes, SMIC, TSMC

June 4, 2015

COMPUTEX 2015: Taiwan and mainland China face off in IoT platforms

It wasn't just ARM and TSMC that launched a 55nm IoT platform this week. Across the Taiwan Strait, Brite and SMIC have unveiled a similar offering. The competition could tell us a lot about the IoT market's future.

Article | Topics: Commentary, Design to Silicon, Blog - EDA, Embedded, IP, - Product | Tags: 55nm, China, foundry, internet of things, smart cities, smart homes, Taiwan | Organizations: Arm, Brite Semiconductor, CEVA, SMIC, TSMC, XMC

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