Blog Topics

June 23, 2020

Mentor to use UltraSoC acquisition to drive in-life learning

Siemens has agreed to acquire UK-based debug and on-chip instrumentation startup UltraSoC and will fold the operation into Mentor’s Tessent test-software product line.
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June 23, 2020

How to draw upon Mentor-Microsoft integration for embedded IoT

The combination of Embedded Linux and Azure is supported by services and technologies that speed the delivery and deployment of MCU-based projects.
June 18, 2020

Kioxia looks to waferscale flash drives for fast, low-cost storage

Waferscale SSDs are among the future drive architectures being explored by Kioxia, according to a keynote delivered at VLSI Symposia.
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June 18, 2020

How Ambarella met the demands of automotive DFT

Even experienced IC design houses must adopt innovative and emerging strategies to meet functional safety and other demands of ISO 26262 for automotive systems.
June 17, 2020

Siemens raises Capital to full E/E design level

Capital has been grown from a wire harness suite to a full electrical/electronic platform with integration for digital twin strategies.
June 16, 2020

Transistor stacks piled high at VLSI

As 2D scaling becomes increasingly difficult, researchers reporting at VLSI Symposia have focused attention on what can be done in the third dimensions to improve density and performance without a sudden break from conventional CMOS processes.
June 15, 2020

EDA in the cloud boosts DRC iterations for AMD

AMD worked with Microsoft and Azure to cut DRC runtimes and control memory usage for a 7nm cloud-based design.
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June 10, 2020

Onchip sensors aim for finer-granularity heat measurements

Moortec has reworked its thermal-sensing core design to allow for finer-grained use on SoCs being designed for the 5nm node.
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June 9, 2020

Real Intent tries to shift left on DFT

Real Intent has launched a DFT tool intended to relax the bottlenecks that occur as an SoC project moves into its final phase ahead of tapeout.
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May 28, 2020

IEDM plans for San Francisco in December

The IEEE plans to stage the 66th International Electron Device Meeting as a physical event in mid-December.
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