Siemens has agreed to acquire UK-based debug and on-chip instrumentation startup UltraSoC and will fold the operation into Mentor’s Tessent test-software product line.
The combination of Embedded Linux and Azure is supported by services and technologies that speed the delivery and deployment of MCU-based projects.
Waferscale SSDs are among the future drive architectures being explored by Kioxia, according to a keynote delivered at VLSI Symposia.
Even experienced IC design houses must adopt innovative and emerging strategies to meet functional safety and other demands of ISO 26262 for automotive systems.
Capital has been grown from a wire harness suite to a full electrical/electronic platform with integration for digital twin strategies.
As 2D scaling becomes increasingly difficult, researchers reporting at VLSI Symposia have focused attention on what can be done in the third dimensions to improve density and performance without a sudden break from conventional CMOS processes.
AMD worked with Microsoft and Azure to cut DRC runtimes and control memory usage for a 7nm cloud-based design.
Moortec has reworked its thermal-sensing core design to allow for finer-grained use on SoCs being designed for the 5nm node.
Real Intent has launched a DFT tool intended to relax the bottlenecks that occur as an SoC project moves into its final phase ahead of tapeout.
The IEEE plans to stage the 66th International Electron Device Meeting as a physical event in mid-December.
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