Does 2.5DIC call for IC design tools for the packaging?
Siemens has published a white paper that examines whether package designers need to adopt IC tools and design styles in the move from organic packages to 2.5DIC packages.
Blog Topics
Semidynamics adds flexible vectors to RISC-V cores
Semidynamics has released a customizable vector unit with out-of-order execution support to accompany its 64bit RISC-V processor cores.
X-Fab introduces BCD-on-SOI at 110nm
X-Fab Silicon Foundries claims to be the first with a foundry offering for 110nm BCD-on-SOI technology, aimed primarily at automotive designers.
Charting the path for machine learning in functional verification
A comprehensive review of ML's potential and its current use identifies challenges ahead.
UK projects builds models for quantum computer controls
Partners in the UK’s CryoCMOS Consortium have developed models that are expected to help deliver CMOS chips that will work inside cryostats.
Alps Alpine composes capacitance IC with Symphony
The company says the mixed-signal platform enabled a 5X improvement in verification productivity.
Achieving functional coverage of multi-language designs
There is no comprehensive standard yet for functional coverage across designs using SystemC, TLM, UVM and SystemVerilog, but there are options using UVM Connect.
Semidynamics pushes configurability on RISC-V core for HPC
Processor IP company will incorporate custom instructions and other changes in its superscalar core, which includes a novel memory unit for sparse matrices.
DVCon Europe adds research track
DVCon Europe is expanding coverage into research on design verification for its 10th conference later this year.
Arm signs sub-2nm deal with Intel foundry operation
Intel Foundry Services has signed a deal with Arm that will see the two companies work on a program of system and design-technology co-optimization.
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