The major West Coast technical conference for lithography is just two weeks away and offers a packed agenda.
Synopsys has introduced TetraMAX II, a faster and more parallelisable ATPG and diagnostics solution, which is now also certified for use in ISO 26262 compliant automotive designs.
Open-source hardware, in-field configurability, and a hardware-plus-services approach could protect margins as the IoT hammers down costs, says GSA report.
High powered alliance develops TLM standards to address growing automotive and IoT concerns.
Silicon Impulse program adds partners to ease industrialisation of ultra-low power IC designs based on FD-SOI processes
Benchmarking organization EEMBC has kicked off an effort to develop a set of performance tests for edge nodes for the Internet of Things (IoT).
The FD-SOI technology developed by CEA-Leti and STMicroelectronics is beginning to gain ground as chipmakers investigate the process as a way to deliver low-energy, wireless-capable SoCs.
As plans crystallize to take FD-SOI down to 10nm, CEA-Leti argues that the technology can provide an alternative path to that of finFETs to get to 7nm processes and beyond.
DVCon Europe brings design and verification insights to Munich next week.
ARM's latest core, the dual-issue M7 borrows features from the Cortex-R family for safety-critical applications as well as adding the option of cache memory.
View All Sponsors