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April 10, 2013

3D-IC cooling ascends the agenda

US defense research agency DARPA sets targets for cooling overall systems and hot spots in stacked silicon, and backs joint research from Rockwell-Collins and Georgia Tech.
Article  |  Topics: Design to Silicon, Blog - EDA  |  Tags: ,   |  Organizations: , ,
February 27, 2012

System-level design meets power

In the world of power semiconductors, not many companies try to go fabless. The tradeoffs between design and process offer many more options for system-level design, argued Infineon's Reinhard Ploss at the ISS Europe conference.
Article  |  Topics: Commentary, Conferences, Blog - EDA  |  Tags: , , , , ,

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