Siemens EDA

December 6, 2017

Learn how to simplify power states in UPF

UPF power state tables have become unwieldy due to rapid growth in LP design. The new construct, 'add_power_state' enables better verification flows.
Article  |  Topics: Blog - EDA, - Standards, Verification  |  Tags: , , ,   |  Organizations: , , ,
December 1, 2017

Workshop sees the RISC-V ecosystem expand

The RISC-V workshop in California at the end of November 2017 provided the opportunity for Western Digital to commit its own work on processors for internal use to the open-source architecture and for the ecosystem of off-the-shelf cores and tools to expand.
November 21, 2017

Siemens builds Mentor AMS offering with Solido buy

Solido acquisition will also add further machine learning expertise to Mentor's capabilities.
October 17, 2017

Arm TechCon 2017 preview: Mentor

Mentor will present seven papers during the ARMTech Con and a dedicated session, and exhibit at Booth #606.
July 7, 2017

How automotive test is evolving for the age of autonomous vehicles

Automotive test has never been easy. Safety made sure of that. But the move to autonomous vehicles is making it more challenging still.
June 20, 2017

Siemens sees Mentor helping to build fast digital twins

An emulator that extends the reach of hardware acceleration into the world of multiphysics analysis could result from the merger of Siemens PLM Software with Mentor.
Article  |  Topics: Blog - EDA, Electrical Design, Embedded, PCB  |  Tags: , , , , , , , ,   |  Organizations: ,
June 14, 2017

DAC 2017 preview: ESD Alliance

EDA's leading association will be visible across the program at DAC 2017 from CEO interviews to social events.
June 1, 2017

DAC 2017 preview: Mentor

Mentor, a Siemens business, has released details on its varied activities at DAC 2017, ranging from panels to technical papers.
Article  |  Topics: Blog Topics  |  Tags: ,   |  Organizations: , , ,
May 30, 2017

How Mentor realized concurrent engineering for PCB design

The vendor's experiences in enabling concurrent engineering in Xpedition Enterprise contain lessons for all design disciplines.
May 12, 2017

Toshiba case study describes advanced thermal simulation

Japanese giant uses variable thermal simulation on automotive IC intended for harsh environments.