March 14, 2024
Arm is working with Cadence and Siemens on separate projects to support its plans in the SDV space.
January 21, 2024
A new paper looks at examples for using The Boundary Condition Independent Reduced Order Model (BCI-ROM) in its VHDL-AMS implementation for electro-thermal analysis.
November 30, 2023
Solido discusses how it has leveraged AI for SPICE level efficiency and the benchmarks it has used.
November 20, 2023
South Korea's leading research institute has built a reusable flow for lower power petaflops-performance AI.
November 17, 2023
Siemens has made its PAVE360 automotive digital-twin software available on AWS, with the ability to access fast Arm models on the same cloud.
November 15, 2023
Siemens has completed the acquisition of Insight EDA, a specialist in circuit-reliability analysis.
October 24, 2023
Chiplet-based 3DIC designs present new challenges for flows that integrate tasks from design exploration to physical verification.
October 9, 2023
From tutorials to technical papers to special 'diamond' sessions, Tessent features large at ITC 2023.
October 9, 2023
Tessent RTL Pro allows wrapper cells and x-bounding logic to be inserted earlier in designs.
October 3, 2023
Siemens and CEA-List have signed a deal under which the two organisations will research the combination of digital-twin and AI.