Arm adds Corellium expertise for IoT to its Virtual Hardware platform
The start-ups virtualization platform has already been gaining traction in comms and security.
Archives
Siemens automates test to handle multi-die 2.5D, 3D and 5.5D architectures
Tessent Multi-die extends the capabilities of the DFT suite in line with new standards intended to enable widespread adoption of interposer and stacked die strategies.
Nvidia proposes split-level link for chiplet interconnect
Nvidia revealed at its Fall GTC work the company has done on a bidirectional energy-saving chiplet interconnect that could hit the equivalent of 50Gbit/s per line.
X-Fab to add 130nm SiGe with IHP deal
X-Fab is using IHP technology to add a 130nm silicon germanium process to its offering.
Use equivalence checking to retarget obsolete FPGA designs
Equivalence checking supports the efficient reuse of designs that reside on out-of-date silicon but remain valid in their own right.
Parasitic extraction challenges intensify for 5G
5G IC designs have needed aggressive innovation across many elements and more use of FD-SOI that both pose parasitic extraction challenges.
Cybersecurity must be built in not bolted on
Learn how one of the leading tool vendors addresses the security of its products and customer data through a ground-up cybersecurity strategy.
Intel and partners join for RISC-V development push
Intel's Pathfinder for RISC-V is intended to boost the use of the architecture among a wider range of SoC design teams.
Imperas releases RISC-V coverage library as open source
Imperas Software has published an open-source functional-coverage library for RISC-V cores.
Accellera attempts to standardize CDC data
Accellera is on the first stage of setting up a working group to create a standard for exchanging information on clock domain crossing checks.