CFD


February 1, 2024

Future Facilities core drives Cadence thermal suite

Cadence has introduced a platform for performing thermal and thermal-stress analysis of subsystems, from 2.5D and 3DICs to PCBs and complete electronic assemblies.
Article  |  Topics: Blog - EDA, PCB  |  Tags: , , ,   |  Organizations:
July 12, 2022

Devgan plans for optimization through machine learning

Cadence president expects expanded role for reinforcement learning in tool portfolio and looks for help on AI for verification.
Article  |  Topics: Blog - EDA  |  Tags: , , , , , ,   |  Organizations:
March 31, 2017

Combining 1D and 3D CFD simulation for piping systems

Computational fluid dynamics now addresses more of the simulation activities required for complex systems in a single methodology.
March 18, 2013

Flotherm release moves thermal planning to concept stage

Mentor Graphics has release a version of its Flotherm tool that makes it possible to build accurate models of heat flow through electronic systems from initial concepts through to prototypes without the extensive manual rework that these analyses have needed traditionally.
Article  |  Topics: Blog - PCB  |  Tags: ,   |  Organizations:

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