Tech Design Forum
Briefing
mechanical
mechanical
October 24, 2023
Flow evolution for the 3DIC/chiplet age
Chiplet-based 3DIC designs present new challenges for flows that integrate tasks from design exploration to physical verification.
Article | Topics:
Blog - EDA
,
- General
,
Packaging
,
Physical design
,
Verification
| Tags:
3DIC
,
chiplet
,
design exploration
,
electromigration
,
IR drop
,
mechanical
,
physical verification
,
power
,
thermal
| Organizations:
Siemens EDA
October 7, 2019
Master the design and verification of next gen transport: Part Four – emulation
Emulation is already playing a vital role in advanced automotive design within a digital twin environment.
Article | Topics:
Commentary
,
Digital/analog implementation
,
Blog - EDA
,
- Next Generation Design
,
Verification
| Tags:
automotive
,
digital twin
,
ECU
,
emulation
,
mechanical
,
multi-disciplinary design
,
safety
,
simulation
,
system of systems
,
validation
| Organizations:
DVCon
,
DVCon China
,
DVCon Europe
,
DVCon US
,
Siemens EDA
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