VLSI Symposium 2024 looks to bridge digital and physical

By TDF Staff |  No Comments  |  Posted: October 25, 2023
Topics/Categories: Blog - EDA, IP  |  Tags: , , , ,

The IEEE Symposium on VLSI Technology & Circuits switches back to Honolulu for its 44th year in the summer of next year and has issued its call for papers, with a deadline of early February for contributions.

Merged into one symposium since 2022, covering both processes and circuit design, next year’s event is focusing on “bridging the digital and physical worlds with efficiency and intelligence”. The five-day event will run from June 16 to 20, 2024, with on-demand access to technical sessions starting the following week.

The symposium aims to cover technology developments and innovative circuit design, and the applications they enable, in fields such as artificial intelligence, IoT, wearables, cloud, virtual reality and augmented reality, and robotics. For process development, the committee is looking for submissions on advanced packaging and buried or backside interconnect in high-density CMOS, as well as beyond-CMOS devices. The conference will cover design-technology co-optimization (DTCO) topics as well as a variety of circuit-design topics.

Complete details for paper submission, with a deadline of February 5, 2023, can be found online at: https://www.vlsisymposium.org/first-announcement-and-call-for-papers/
Special events at the Symposium include career mentoring events for Women in Engineering and Young Professionals sponsored by the IEEE Electron Devices Society and the Solid State Circuits Society, and a traditional Hawaiian luau celebration.

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