Yearly Archives: 2014

EUV may be getting most R&D cash but the world's biggest foundry says e-beam currently has the edge on defects and double patterning.

Intel aims to use a dual-pronged strategy that takes advantage of internet of things applications to push the x86 back into embedded-systems designs.

Manufacturing giant says we need a new category of WPUs - wearables processing units - to create a mass market and that ARM needs to go smaller than the MO.

Focus on systemic issues matches DVCon Europe event to European interests

ARM and Cadence have teamed up to show how system-level and implementation-level representations of a mixed-signal design can be linked together and kept in sync as the project progresses.

Will help industry giants develop more reliable power electronics systems for applications including transport and power generation.

ARM is working on a heavily multithreaded version of its processor core to see if it can provide a more convenient alternative to GPUs.

Gold Standard Simulations has run simulations to work out how much of an improvement Intel's new rectangular shape represents.

Design for the 20nm generation of processes has revealed power and clocking issues for the two major FPGA manufacturers presentations at Hot Chips revealed.

Two of the custom designs presented at the 26th Hot Chips in Cupertino exemplified the problems caused by increasing power density and the benefits of looking at heat removal at the system level.