Intel

DVCon Europe brings design and verification insights to Munich next week.

Intel aims to use a dual-pronged strategy that takes advantage of internet of things applications to push the x86 back into embedded-systems designs.

Gold Standard Simulations has run simulations to work out how much of an improvement Intel's new rectangular shape represents.

Despite the swirl of interest in the internet of things progress is likely to be held back by interoperability issues according to speakers at the recent NI Week conference.

At DAC 2014, Intel’s chief security architect Ernie Brickell described the processor maker’s approach to protecting hardware and software from hacks and attacks.

A research-focused session at DAC 2014 looks at using coupled oscillators rather than charge transfer to process data.

At DAC 2014, some 30 per cent of exhibitors are IP suppliers, offering design services or both, demonstrating how system-level design is about building on what has gone before.

The 2013 edition of the International Technology Roadmap for Semiconductors has been published. The latest set of tables underlines the slowdown in some aspects of scaling, particularly when it comes to metal interconnect.

Deal quashes rumors that Altera was about to move its cutting edge production back to TSMC, but nor does it appear to be 'exclusive' for 3D products.

TSMC stays the course with new co-CEOs as Morris Chang retains executive leadership for now while finFET, 3D and other new technologies settle in.