EUV

October 24, 2016

7nm finFET process techniques lead IEDM lineup

At the 62nd annual IEDM taking place in early December two of the leading groups in process development will take the wraps off their 7nm finFET technologies.
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February 23, 2016

Directed self assembly may offer similar benefits to EUV, process modeling study says

Directed self assembly techniques may offer similar benefits to EUV lithography, especially for DRAM makers, says SPIE conference paper
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February 11, 2016

SPIE Advanced Lithography Preview: Mentor Graphics

The Calibre vendor will have a strong technical presence at the leading lithography conference taking place in late February in San Jose.
October 9, 2015

IMEC 5nm test chip to explore EUV and SAQP litho options

IMEC and Cadence have taped out a test chip intended to explore key lithography and metal-interconnect issues that will face users of the forthcoming 5nm process node.
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July 9, 2015

IBM and friends at 7nm: breakthrough or science project?

IBM, GlobalFoundries, Samsung and SUNY deserve kudos for manufacturing the first 7nm chip but the NREs involved still look frightening.
September 11, 2014

TSMC: e-beam winning on cost over EUV for lithography

EUV may be getting most R&D cash but the world's biggest foundry says e-beam currently has the edge on defects and double patterning.
Article  |  Topics: Design to Silicon, Blog - EDA  |  Tags: , , , , , , ,   |  Organizations: , , ,
June 13, 2014

Path to 5nm plotted at DAC panel

Panel discusses Moore's law scaling beyond the 14nm node to 5nm, where economic, device, interconnect, materials, lithography and design issues abound
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March 26, 2014

Even EUV faces a 1D future, says IMEC

IMEC's Rudy Lauwereins explained at DATE 2014 how 1D routing for self-aligned multiple patterning is likely to be inevitable even if EUV makes it into production fabs.
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May 22, 2013

Gartner: Multi-patterning here to stay, EUV lithography still 50:50

Plan around 193nm immersion lithography. Alternatives are years off and not guaranteed, says analyst group
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August 6, 2012

TSMC joins Intel as ASML investor to accelerate availability of EUV, 450mm lithography

TSMC follows Intel in taking a stake in ASML to accelerate development of EUV and 450mm lithography equipment.
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