Gartner: Multi-patterning here to stay, EUV lithography still 50:50
Plan around 193nm immersion lithography. Alternatives are years off and not guaranteed, says analyst group
EUV
TSMC joins Intel as ASML investor to accelerate availability of EUV, 450mm lithography
TSMC follows Intel in taking a stake in ASML to accelerate development of EUV and 450mm lithography equipment.
CPTF notebook: From restricted to ‘proscriptive’ design rules
Ever increasing lithography challenges mean the next generation of design rules may concentrate on telling you just what you can rather than what you cannot do.