EUV

August 6, 2012

TSMC joins Intel as ASML investor to accelerate availability of EUV, 450mm lithography

TSMC follows Intel in taking a stake in ASML to accelerate development of EUV and 450mm lithography equipment.
Article  |  Topics: Commentary, Design to Silicon  |  Tags: , ,   |  Organizations: , ,
March 15, 2012

CPTF notebook: From restricted to ‘proscriptive’ design rules

Ever increasing lithography challenges mean the next generation of design rules may concentrate on telling you just what you can rather than what you cannot do.

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