7nm

March 19, 2018

Xilinx plans reconfigurable compute for 7nm FPGA generation

Xilinx plans to make reconfigurable computing the focus of its upcoming generation of FPGAs, which will be made on a 7nm finFET process at TSMC and expected to start sampling next year.
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February 16, 2018

SPIE Advanced Lithography 2018 preview: Mentor

Innovation and advances in EUV and OPC lead Mentor's offerings at SPIE in San Jose later this month.
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January 31, 2018

Analog blocks go digital for faster integration

Movellus has launched the first of a series of IP-creation tools with one that will build all-digital PLLs and integrate them into a design.
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June 21, 2017

Panels see congestion and resistance dominate the leading-edge node battle

Placement-aware synthesis and an array of post-layout recovery steps have helped drive up the clock speed and silicon utilization of a series high-end SoCs on leading-edge processes developed by customers of Synopsys' implementation tools.
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June 18, 2017

Samsung 7nm uses EUV and split fin widths to push speeds

EUV and fin optimization help build Samsung's upcoming 7nm process, the company discloses at the VLSI Technology Symposium.
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May 12, 2017

Advanced processes feature at VLSI in June

Among the papers at this year's VLSI Symposia in Hawaii in June, Samsung will describe a 7nm CMOS process that uses EUV lithography to tighten up device features on minimum-pitch interconnects.
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December 7, 2016

IMEC stacks nanowire transistors together on CMOS

IMEC has claimed at IEDM to have implemented for the first time the CMOS integration of vertically stacked nanowire transistors.
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August 27, 2016

Creating a reference design flow for 10nm processes: video

Synopsys video details challenges of 10nm design and its collaboration with Samsung Semiconductor to build a full flow to address them.
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June 20, 2016

DTCO points to sub-10nm optimizations

DTCO work by GlobalFoundries and Qualcomm reported at VLSI Symposia shows the need to minimize fin counts in future finFET processes.
Article  |  Topics: Blog - EDA, Embedded  |  Tags: , , , , , ,   |  Organizations: ,
April 7, 2016

SNUG 2016: Intel, TSMC, GloFo back post-finFET research at UC Berkeley

But project lead Chenming Hu, 'finFET's father', has also highlighted important changes in the funding landscape for university research.

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