SPIE Advanced Lithography

April 11, 2024

Refining DTCO to bridge data walls in system design

DTCO (design technology co-optimization) looks to address systemic verification challenges but the process still needs to be extended.

Article | Topics: DFM, Verification | Tags: design technology co-optimization, DRC, DTCO, machine learning, metrology, opc | Organizations: Siemens EDA, SPIE Advanced Lithography

February 16, 2018

SPIE Advanced Lithography 2018 preview: Mentor

Innovation and advances in EUV and OPC lead Mentor's offerings at SPIE in San Jose later this month.

Article | Topics: Conferences, Design to Silicon | Tags: 3nm, 5nm, 7nm, calibre, EUV, hotspot, lithography, opc | Organizations: Siemens EDA, SPIE Advanced Lithography

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