Archives

November 27, 2018

Synopsys fuses synthesis and place-and-route to improve IC design quality and time to results

Fusion Compiler uses a single, scalable data model, updated optimization engines, and an analysis backbone based on the industry's golden sign-off tools.
Article  |  Topics: Blog - EDA, - Product  |  Tags: , ,
November 15, 2018

Xpedition updated for schematic verification and DFT

Mentor's flagship PCB suite is aiming to offer another 'shift left' in verification as respins rise.
Article  |  Topics: Blog - PCB  |  Tags: , , , , ,   |  Organizations:
November 14, 2018

Case study: Achieving earlier signoff convergence and a ‘shift left’ for P&R at Qualcomm

Qualcomm has described its use of Calibre RealTime Digital to enhance its P&R flow.
November 13, 2018

Accellera updates UVM reference implementation

Accellera has updated the reference implementation for the Universal Verification Methodology to reflect the changes made for the latest release of the standard.
Article  |  Topics: Blog - EDA  |  Tags: ,   |  Organizations:
November 7, 2018

Symphony raises crescendo for AMS simulation

Mentor's updated AMS platform claims performance boost by obviating 'legacy' technology.
Article  |  Topics: Blog Topics  |  Tags: , , , ,   |  Organizations: , , , , ,
November 6, 2018

Netronome launches chiplet initiative for network-accelerator SIPs

Data-center networking specialist Netronome has recruited a number of silicon makers and IP suppliers to a standard for chiplet designs that can be used in SIPs for edge computers and servers.
Article  |  Topics: Blog - EDA, IP, PCB  |  Tags: , , ,   |  Organizations: , , , ,
October 31, 2018

Cadence adds deep-learning support to audio DSP

Cadence has added direct support for neural networks to the latest iteration of its DSP cores aimed at audio systems.
Article  |  Topics: Blog - Embedded, IP  |  Tags: , , , ,   |  Organizations: ,
October 29, 2018

Mentor extends Tessent for debug and automotive pattern generation

As ITC 2018 begins, Mentor addresses stringent ISO 26262 requirements and looks to bridge the gap in how IJTAG-based debug is structured.
Article  |  Topics: Tested Component to System  |  Tags: , , , ,   |  Organizations: , ,
October 22, 2018

IEDM to examine scaling from multiple directions

CMOS moving to 3nm and DRAM going beyond 20nm scaling are two of the late papers at the upcoming IEDM and part of a larger examination of semiconductor trends.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , ,   |  Organizations: , ,
October 17, 2018

FPGA playing verification catch-up as bugs escape

The latest Mentor-commissioned Wilson Research Group study on ASIC and FPGA verification highlights technique adoption and maturity.