Cameron EDA

April 28, 2022

Go inside proposals for common chiplet models

Chiplets will need models to guarantee heterogenous SiP implementation. A cross-industry working group describes its progress so far.

Article | Topics: Blog Topics | Tags: advanced packaging, CDX, chiplet, ecosystem, heterogenous, OCP, ODSA, SIP, standards | Organizations: Cameron EDA, Chip Design Exchange, Palo Alto Electron, Siemens EDA, Thrace Systems

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