3DIC

Head of TSMC R&D talks about what it will take to develop and use 10nm, 7nm processes, and a possible shift to using packaging to extend Moore's law scaling

Qualcomm is looking to monolithic 3D and smart circuit architectures to make up for the loss of traditional 2D process scaling as wafer costs for advanced nodes continue to increase.

The automotive sector could become one of the key markets for 3D integration according to the head of Audi's progressive semiconductor program.

Glass may be the high frequency interposer option given silicon concerns about power and noise. TSMC adds another pathfinder to its 3D arsenal.

TSMC stays the course with new co-CEOs as Morris Chang retains executive leadership for now while finFET, 3D and other new technologies settle in.

Stacked 3D-IC memory-on-logic is on the packaging company's roadmap, but there are still yield hurdles to scale at the MEOL.

Packed one-day event has speakers from Cadence, TSMC, Samsung, Amkor, Advantest and more providing a senior level view of making 3D-IC a reality. Registration closes soon.

Memoir Systems has developed a set of memory controller IP cores that exploit common access patterns used by processors in network switches to improve performance and power consumption

FinFETs, ever proliferating verification, 3DIC, security and more feature on our guide to some of the most intriguing panels at DAC 2013.

The chip industry faces problems as foundries and the packaging industry compete over 3D technologies. If resolved, it could mean a new dawn in ASIC design.