Author Archives: Paul Dempsey

About Paul Dempsey

Paul Dempsey is editor-in-chief of Tech Design Forum and has been a technology journalist for 20 years. His work has also appeared in EETimes, Red Herring and specialist journals published by the Financial Times.
June 1, 2017

DAC 2017 preview: Mentor

Mentor, a Siemens business, has released details on its varied activities at DAC 2017, ranging from panels to technical papers.
Article  |  Topics: Blog Topics  |  Tags: ,   |  Organizations: , , ,
May 30, 2017

How Mentor realized concurrent engineering for PCB design

The vendor's experiences in enabling concurrent engineering in Xpedition Enterprise contain lessons for all design disciplines.
May 16, 2017

Imagination sells design services, software integration to Sondrel

Engineering consultancy pays undisclosed sum for IMGworks division.
Article  |  Topics: Blog - EDA, - GDSII, Blog - IP  |  Tags: , , , ,   |  Organizations: ,
May 12, 2017

Toshiba case study describes advanced thermal simulation

Japanese giant uses variable thermal simulation on automotive IC intended for harsh environments.
May 3, 2017

Master the verification challenge of PCIe-based NVMe storage

NVMe is driving the SSD market thanks to its many useful features, but at least five major challenges must inform your verification plan.
Article  |  Topics: Blog - EDA, - Standards, Verification  |  Tags: , , , ,   |  Organizations: ,
May 2, 2017

Wally Rhines looks beyond ‘endless verification’ to the system era

DVCon China saw Mentor's chairman and CEO give a typically thorough keynote on the evolving challenges for verification.
April 6, 2017

Leverage AI and centralized processing for L-5 autonomous vehicles

L-5 autonomous vehicles need centralized raw data analysis with machine learning to cope with the demands of ASIL-D functional safety. Mentor's response is DRS360.
April 6, 2017

Bridging the gap between IP development and qualification for P&R

Learn how to pre-empt timing and congestion issues that could arise after synthesis by using 'PlaceFirst' technology within Oasys-RTL.
March 31, 2017

Combining 1D and 3D CFD simulation for piping systems

Computational fluid dynamics now addresses more of the simulation activities required for complex systems in a single methodology.
March 23, 2017

Leverage a zero-cost proof-of-concept platform for the IoT

ARM and Tanner EDA aim to chart a path toward cheaper, easier to realize designs for the embedded and Internet-of-Things markets.