About Paul Dempsey
Paul Dempsey is editor-in-chief of Tech Design Forum and has been a technology journalist for 20 years. His work has also appeared in EETimes, Red Herring and specialist journals published by the Financial Times.
May 16, 2017
Engineering consultancy pays undisclosed sum for IMGworks division.
May 12, 2017
Japanese giant uses variable thermal simulation on automotive IC intended for harsh environments.
May 3, 2017
NVMe is driving the SSD market thanks to its many useful features, but at least five major challenges must inform your verification plan.
May 2, 2017
DVCon China saw Mentor's chairman and CEO give a typically thorough keynote on the evolving challenges for verification.
April 6, 2017
L-5 autonomous vehicles need centralized raw data analysis with machine learning to cope with the demands of ASIL-D functional safety. Mentor's response is DRS360.
April 6, 2017
Learn how to pre-empt timing and congestion issues that could arise after synthesis by using 'PlaceFirst' technology within Oasys-RTL.
March 31, 2017
Computational fluid dynamics now addresses more of the simulation activities required for complex systems in a single methodology.
March 23, 2017
ARM and Tanner EDA aim to chart a path toward cheaper, easier to realize designs for the embedded and Internet-of-Things markets.
March 14, 2017
Intel subsidiary's new Titanium Control platform pulls the analysis and management of legacy hardware control systems into the cloud.
March 13, 2017
Implementation uses dedicated PULP technology in silicon for Green Waves Technologies on TSMC's 55nm LP process.