Author Archives: Paul Dempsey

About Paul Dempsey

Paul Dempsey is editor-in-chief of Tech Design Forum and has been a technology journalist for 20 years. His work has also appeared in EETimes, Red Herring and specialist journals published by the Financial Times.
May 28, 2019

ARM adds Cortex-A77 and Mali-G77 cores for 5G and ML

The company is also bundling its new CPU and GPU cores in a premium IP platform that can be tuned for next generation applications and devices.
Article  |  Topics: Blog Topics  |  Tags: , , , , , , , , , , , ,   |  Organizations: ,
May 27, 2019

Automotive complexity drives DFT to the RTL

Design-for-test can no longer be left until the gate level for increasingly sensitive designs aimed at newer processes.
Article  |  Topics: Blog - EDA, - Tested Component to System  |  Tags: , , , ,   |  Organizations:
May 23, 2019

AI and ML fuel Catapult and Calibre updates

Mentor takes the wraps off new machine learning fueled features in its HLS and physical design families ahead of DAC 2019.
May 20, 2019

How PAVE360 helps set a path toward the automotive digital twin

Siemens' new automotive platform commercializes and illustrates the company's ongoing integration of Mentor EDA products within its digital twin concept.
April 26, 2019

The evolution of the digital twin

A digital twin is now more than just a virtual copy of a product. For Siemens, it is a multilayered concept powering a 'boundary-free innovation platform'.
Article  |  Topics: Commentary, Conferences, Blog - EDA, PCB  |  Tags: , , , ,   |  Organizations: , ,
April 17, 2019

ES Design West aims to showcase EDA to a widening world

ES Design West holds its first edition at San Francisco's Moscone Center colocated with SEMICON West in July.
Article  |  Topics: Blog Topics, Conferences, Blog - EDA  |  Tags:   |  Organizations: ,
March 27, 2019

DVCon China 2019 preview: Mentor

Siemens PLM strategy VP Stefan Jockusch will keynote on digital twins in the automotive sector at next month's conference in Shanghai.
Article  |  Topics: Blog - EDA, - Verification  |  Tags: , , , , ,   |  Organizations: ,
March 11, 2019

China Focus 3: The R&D template

5G has given Beijing a development template to use across its Made in China 2025 program.
Article  |  Topics: Commentary, Conferences, Blog - EDA, IP  |  Tags:   |  Organizations: , , , , ,
February 25, 2019

China Focus 2: The Design Dilemma

Do China's ambitions as a world-class innovator face fundamental challenges as a result of the sector's existing economic infrastructure?
February 18, 2019

How to optimize your testbench-to-DUT connections

Testbench connections often depend on the virtual interface feature of SystemVerilog but other options - like abstract classes - can help.