Author Archives: Paul Dempsey

About Paul Dempsey

Paul Dempsey is editor-in-chief of Tech Design Forum and has been a technology journalist for 20 years. His work has also appeared in EETimes, Red Herring and specialist journals published by the Financial Times.
March 14, 2017

Wind River targets the industrial IoT for virtualization

Intel subsidiary's new Titanium Control platform pulls the analysis and management of legacy hardware control systems into the cloud.
March 13, 2017

Open-Silicon claims RISC-V ultra-low-power first

Implementation uses dedicated PULP technology in silicon for Green Waves Technologies on TSMC's 55nm LP process.
March 7, 2017

Reducing the documentation burden in ISO 26262

The Mentor Safe program aims to increase automotive users' confidence in tools and provide documentation needed for the functional safety standard.
March 6, 2017

Mentor’s Xpedition virtualizes simulation for ruggedized, safety-critical designs

Xpedition adds vibration and acceleration analysis to shorten physical PCB test times for ruggedized and safety-critical designs.
March 2, 2017

How formal concentrates ISO 26262 fault analysis

Formal enables substantial fault pruning and more definitive fault injection for ISO 26262 using techniques such as sequential logic equivalence checking.
February 22, 2017

Streamlining analog fault simulation

Analog fault simulation times have barely fallen for two decades but that is beginning to change.
February 16, 2017

Mentor launches new Strato emulation platform

StratoM hardware has 2.5B-gate capacity and can scale to 15B gates. Throughput claimed at 5X faster than earlier Veloce generation.
Article  |  Topics: Blog - EDA, - Verification  |  Tags: , , , , , , ,   |  Organizations:
February 13, 2017

Harness manufacturing for systems of systems

An eight-part battleplan can help automate one of tougher electrical design challenges.
January 31, 2017

Overcome IoT edge challenges with integrated flows

IoT edge designs are being undertaken by multi-disciplinary teams that must work within the tightest of budgets.
Article  |  Topics: Blog - EDA, Embedded, PCB  |  Tags: , , , , , , , , , , ,   |  Organizations:
December 7, 2016

Overcoming electromigration analysis limitations for larger on-die power grids

Award-winning paper describes new strategy offering both greater speed and accuracy.
Article  |  Topics: Blog Topics  |  Tags: , , ,   |  Organizations: , ,