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October 9, 2023
From tutorials to technical papers to special 'diamond' sessions, Tessent features large at ITC 2023.
September 28, 2023
Get to know more on the specific benefits of shift left and how to achieve easy adoption.
July 10, 2023
Three fast developing AI techniques underpin the efficiencies in the new Solido custom design and verification platform.
June 20, 2023
Single-device tracking in the chiplet and multi-chip age needs a boost to deliver accuracy and greater production efficiency.
April 25, 2023
The company says the mixed-signal platform enabled a 5X improvement in verification productivity.
April 17, 2023
There is no comprehensive standard yet for functional coverage across designs using SystemC, TLM, UVM and SystemVerilog, but there are options using UVM Connect.
December 1, 2022
New Quality Package focuses on safety and cybersecurity compliance with EU and US medical device standards.
November 23, 2022
The Austin-based start-up used Siemens EDA software to deploy a cutting-edge Smart Substrate based on advanced packaging technology.
October 6, 2022
The start-ups virtualization platform has already been gaining traction in comms and security.
September 8, 2022
The system-in-package and module trends in system design promote bringing together physical (DRC) and electrical (LVS) verification.