Author Archives: TDF Editor

About TDF Editor

The head honcho
September 8, 2022

Use equivalence checking to retarget obsolete FPGA designs

Equivalence checking supports the efficient reuse of designs that reside on out-of-date silicon but remain valid in their own right.
September 5, 2022

Parasitic extraction challenges intensify for 5G

5G IC designs have needed aggressive innovation across many elements and more use of FD-SOI that both pose parasitic extraction challenges.
Article  |  Topics: Blog - EDA, - Verification  |  Tags: , , , , , , , ,   |  Organizations:
September 5, 2022

Cybersecurity must be built in not bolted on

Learn how one of the leading tool vendors addresses the security of its products and customer data through a ground-up cybersecurity strategy.
Article  |  Topics: Blog - EDA, - HLS, Tool development  |  Tags: , , , ,   |  Organizations:
April 29, 2022

Navigate variables and lifetimes in SystemVerilog

Variable lifetimes are an apparently basic but also tricky feature within the verification language.
Article  |  Topics: Verification  |  Tags: , , , , ,   |  Organizations: ,
April 28, 2022

Go inside proposals for common chiplet models

Chiplets will need models to guarantee heterogenous SiP implementation. A cross-industry working group describes its progress so far.
April 27, 2022

Verifying the new namespace storage options in NVMe 2.0

The NVMe 2.0 specification has introduced two namespace options that boost SSD performance while optimizing storage life.
Article  |  Topics: Blog - EDA, - Verification  |  Tags: , , , ,   |  Organizations:
March 13, 2022

Learn strategies for better measurement and test in simulation-based PCB design

A new white paper offers useful tips and techniques for PDN analysis and performance optimization in designs such as those using DDR4.
Article  |  Topics: Blog - PCB  |  Tags: , , , , ,   |  Organizations:
February 10, 2022

Capturing connectivity for assembly verification in 2.5D and 3D design

Learn how to ingest data from multiple engineering teams in multiple formats on interposer and other multi-dimensional projects.
Article  |  Topics: Verification  |  Tags: , , , , , , , , ,   |  Organizations:
February 8, 2022

How digital twin evaluations optimize STCO-based design

System Technology Co-optimization raises various SI, PI, thermal, mechanical and warp risks due to its use of advanced packaging. Early-stage prototyping mitigates them.
January 25, 2022

Choose the right advanced packaging methodology for metal fill rules

Advanced packaging requirements from foundries and OSATs pose stringent challenges. A new paper describes three ways of satisfying them.