Conference

The first Chinese edition of Accellera's conference series takes place in Shanghai next Wednesday (April 19).

Implementation uses dedicated PULP technology in silicon for Green Waves Technologies on TSMC's 55nm LP process.

Three Mentor divisions - Embedded, PADS and Tanner EDA - will present their latest innovations during the conference and exhibition in Nuremberg next week.

Analog fault simulation times have barely fallen for two decades but that is beginning to change.

The major verification conference is looming and Mentor's participation will include tutorials that explore the latest in portable stimulus, SystemC, VIP and more.

DesignCon 2017 takes place from Jan 31 to Feb 2 at the Santa Clara Convention Center with its usual focus on PCB design and implementation.

Award-winning paper describes new strategy offering both greater speed and accuracy.

DVCon Europe this year provides a venue for extending UVM, SystemC and TLM for faster, more effective verification its organizing committee claims.

Synopsys has introduced TetraMAX II, a faster and more parallelisable ATPG and diagnostics solution, which is now also certified for use in ISO 26262 compliant automotive designs.

Microsoft has launched an OEM version of the Windows Holographic platform it has developed for its own AR headset, the HoloLens.