Design services


January 19, 2021

Design house recommends earlier start to flip-chip bump layout

Design-services company Sondrel is recommending teams start earlier on package design to avoid delays after IC tapeout.
Article  |  Topics: Blog - EDA, PCB  |  Tags: , ,   |  Organizations:
July 12, 2018

With RF, power and MRAM, FD-SOI finds its role

FD-SOI is gradually building up a presence as a technology not just for low-power but RF and power integration.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , , , , ,   |  Organizations: , , ,
May 16, 2017

Imagination sells design services, software integration to Sondrel

Engineering consultancy pays undisclosed sum for IMGworks division.
Article  |  Topics: Blog - EDA, - GDSII, Blog - IP  |  Tags: , , , ,   |  Organizations: ,
March 13, 2017

Open-Silicon claims RISC-V ultra-low-power first

Implementation uses dedicated PULP technology in silicon for Green Waves Technologies on TSMC's 55nm LP process.

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