Design house recommends earlier start to flip-chip bump layout
Design-services company Sondrel is recommending teams start earlier on package design to avoid delays after IC tapeout.
Design services
With RF, power and MRAM, FD-SOI finds its role
FD-SOI is gradually building up a presence as a technology not just for low-power but RF and power integration.
Imagination sells design services, software integration to Sondrel
Engineering consultancy pays undisclosed sum for IMGworks division.
Open-Silicon claims RISC-V ultra-low-power first
Implementation uses dedicated PULP technology in silicon for Green Waves Technologies on TSMC's 55nm LP process.
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