Flotherm

June 17, 2021

Standard arrives for thermal simulation data

A de facto standard for exchanging thermal information about designs has become JEDEC standard JEP181.

Article | Topics: Blog - EDA, PCB | Tags: chip-package integration, Flotherm, supply chain, system-level design, thermal analysis, thermal modeling, thermal simulation | Organizations: JEDEC, Siemens EDA

March 6, 2017

Embedded World 2017 preview: Mentor Graphics

Three Mentor divisions - Embedded, PADS and Tanner EDA - will present their latest innovations during the conference and exhibition in Nuremberg next week.

Article | Topics: Blog - EDA, Embedded, PCB | Tags: analog, Flotherm, MCAD, mixed signal, Nucleus, PADS, PCB, RTOS, thermal analysis | Organizations: Embedded World, Mentor Graphics, Tanner EDA

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