thermal modeling


June 17, 2021

Standard arrives for thermal simulation data

A de facto standard for exchanging thermal information about designs has become JEDEC standard JEP181.
June 3, 2013

UPF group moves to consider system-power issues

The group that developed the IEEE 1801 Unified Power Format standard is looking to bringing power modeling and estimation to the system level for version 3.0, due in 2015.
March 20, 2013

DATE: The rise of the power architect

Docea Power extends power and thermal analysis tools to address complexity and sub-dividing responsibilities among architects.
Article  |  Topics: Blog Topics, Commentary, Blog - EDA, - ESL/SystemC  |  Tags: , ,   |  Organizations:
March 16, 2012

DATE notebook: Help for heat-sensitive chips

Until the software is ready, it's often hard to tell when two neighbouring units on an SoC could combine to push the package past its maximum thermal point. Docea Power aims to help.

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