DATE: ARM proposes ‘unit of compute’ as basis for energy-efficient systems
ARM CPU chief proposes 'unit of compute' as building block for energy-efficient computation systems
finFET
DATE: Double patterning and finFETs force flexibility on tools
EDA companies are having to plan for the different ways in which double patterning and finFETs could move into fabs, Antun Domic of Synopsys explains.
DATE: Early shift to finFET processes challenges IP development strategies
An early shift to finFET processes is making developing IP libraries more challenging.
Intel foundry to make Altera FPGAs
Intel's announcement that it will make FPGAs for Altera in an upcoming 14nm finFET process will reshape the programmable logic, and foundry, businesses.
GlobalFoundries and Samsung talk finFET progress at CPTF
GlobalFoundries and Samsung described how they are readying finFETs for production at CPTF 2013 and how the 28nm processes will have a long shelf life.
The silicon industry’s crunch time
Future Horizon’s forecast meeting for the first half of 2013 made it clear how the electronics sector and the semiconductor industry in particular is facing big problems.
Samsung lines up tool providers for finFET tapeouts
14nm finFET test-chip designs are moving through Samsung's fab as ARM, Cadence Design Systems and Synopsys continue to check their flows on the new process.
FD-SOI vs finFETs mulled during IEDM
Can planar devices on fully depleted SOI resist the relentless rise of finFETs as the next device architecture of choice for the semiconductor industry? An evening panel at IEDM explored the trade-offs
Semiconductor roadmap gets fuzzier at IEDM
Semiconductor process options outlined at IEDM by Luc van den Hove of imec as industry faces hard choices and rising costs
Oxygen injection for go-faster 14nm transistors
Mears Technologies and UC Berkeley describe at IEDM 2012 how oxygen in a silicon superlattice could boost performance beyond strained silicon at 14nm.
PLATINUM SPONSORS
View All Sponsors