Tech Design Forum
Briefing
density fill
density fill
March 20, 2013
DATE: Early shift to finFET processes challenges IP development strategies
An early shift to finFET processes is making developing IP libraries more challenging.
Article | Topics:
Conferences
,
Blog - EDA
,
IP
| Tags:
14nm
,
16nm
,
20nm
,
28nm
,
DATE 2013
,
density fill
,
finFET
| Organizations:
Synopsys
December 4, 2012
IPSoC: 20nm causes analog ‘density fill headaches’
20nm design is fraught with problems for analog design but one that causes the biggest headaches is density variation, says Synopsys' Joachim Kunkel.
Article | Topics:
Blog - EDA
| Tags:
20nm
,
density fill
,
IPSoC 2012
,
mixed signal
| Organizations:
Synopsys
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