Gary Smith EDA: PCB ‘a door to the future’ but ‘slow take-off’ for ESL
The leading EDA analyst also charts growth for RTL and IC CAD in 2014 Market Share Summary, and highlights system-driven shifts in tool evaluation.
3D-IC
Intel and Altera extend foundry deal into interposer and full 3D
Deal quashes rumors that Altera was about to move its cutting edge production back to TSMC, but nor does it appear to be 'exclusive' for 3D products.
TSMC succession plan emphasizes stability
TSMC stays the course with new co-CEOs as Morris Chang retains executive leadership for now while finFET, 3D and other new technologies settle in.
TSMC demonstrates readiness for 3D-IC
Research projects to verify methodologies, address third-party integration challenges and add a low-cost interposer-like technology to the 3D-IC family make their mark.
Amkor keeps question mark next to ‘full’ 3D-IC in 2016
Stacked 3D-IC memory-on-logic is on the packaging company's roadmap, but there are still yield hurdles to scale at the MEOL.
3D-IC focus for GSA’s Taipei Memory+ event next week
Packed one-day event has speakers from Cadence, TSMC, Samsung, Amkor, Advantest and more providing a senior level view of making 3D-IC a reality. Registration closes soon.
Altera outlines process roadmap for ‘Gen 10’ FPGAs
Altera has disclosed a number of the features that will make it into the top end of its upcoming 'Generation 10' family of FPGAs.
DAC 2013 Preview VII: Verification and simulation
DAC 2013's technical program has four sessions on innovation for verification. Some of the hot topics being covered include 3DIC and analog.
3D-IC cooling ascends the agenda
US defense research agency DARPA sets targets for cooling overall systems and hot spots in stacked silicon, and backs joint research from Rockwell-Collins and Georgia Tech.
DATE: Dark clouds gather over 3D integration, panelist tells conference
The chip industry faces problems as foundries and the packaging industry compete over 3D technologies. If resolved, it could mean a new dawn in ASIC design.