mechanical design

December 18, 2014

Gary Smith EDA: PCB ‘a door to the future’ but ‘slow take-off’ for ESL

The leading EDA analyst also charts growth for RTL and IC CAD in 2014 Market Share Summary, and highlights system-driven shifts in tool evaluation.

Article | Topics: Blog Topics, Commentary, Design to Silicon, Digital/analog implementation, Blog - EDA, - ESL/SystemC, GDSII, Blog - PCB, - RTL, Tested Component to System, Verification | Tags: 2.5D-IC, 3D-IC, ESL, finFET, market research, mechanical design, MEMS | Organizations: Gary Smith EDA

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