About Paul Dempsey
Paul Dempsey is editor-in-chief of Tech Design Forum and has been a technology journalist for 20 years. His work has also appeared in EETimes, Red Herring and specialist journals published by the Financial Times.
September 2, 2019
Concerns that the diplomatic stand-off between Seoul and Tokyo could hit the supply chain rose again this weekend as South Korean politicians made a surprise visit to disputed islands.
July 3, 2019
The US Quantum Economic Development Consortium is looking to stimulate a supply chain and technology infrastructure for quantum computing, with more about its efforts due to come out in the next few days.
May 28, 2019
The company is also bundling its new CPU and GPU cores in a premium IP platform that can be tuned for next generation applications and devices.
May 27, 2019
Design-for-test can no longer be left until the gate level for increasingly sensitive designs aimed at newer processes.
May 23, 2019
Mentor takes the wraps off new machine learning fueled features in its HLS and physical design families ahead of DAC 2019.
May 20, 2019
Siemens' new automotive platform commercializes and illustrates the company's ongoing integration of Mentor EDA products within its digital twin concept.
April 26, 2019
A digital twin is now more than just a virtual copy of a product. For Siemens, it is a multilayered concept powering a 'boundary-free innovation platform'.
April 17, 2019
ES Design West holds its first edition at San Francisco's Moscone Center colocated with SEMICON West in July.
March 27, 2019
Siemens PLM strategy VP Stefan Jockusch will keynote on digital twins in the automotive sector at next month's conference in Shanghai.
March 11, 2019
5G has given Beijing a development template to use across its Made in China 2025 program.
