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Designers should plan ahead for future process changes as conventional silicon CMOS runs out of steam, IMEC's Rudy Lauwereins told delegates at the International Electronics Forum in Bratislava this week.

The semiconductor industry is reaching a crunch point at which companies that form it have to work together much more closely, says Malcolm Penn of Future Horizons.

Open-source hardware is going to change the way people buy computing capacity for data centers, says LSI's Rob Ober

Achronix plans to use the FPGA fabric that it has developed for standalone products to be fabbed through Intel as the springboard for an embedded-FPGA offering.

Samsung Electronics is setting up a center in Silicon Valley to try to develop technologies that the company hopes will ultimately drive volume for its chipmaking operation.

The scope of the Low-Latency Interface (LLI) developed by the MIPI Alliance is expanding as it heads towards version 2 – increasing the ways in which a single DRAM array can be shared between SoCs in a mobile phone.

Cadence Design Systems has updated both of its printed circuit board (PCB) tools – Allegro and Orcad – to improve their handling of design constraints, multiuser design and deal with embedded components and mechanical CAD tools.

GlobalFoundries has confirmed its 14nm process as the one that will see the foundry introduced finFET-based transistors, claiming that its approach is optimized for mobile devices

Carbon Design Systems' CTO Bill Neifert argues that his company's deal with Samsung sends a clear signal, whether or not you're one of his customers.

Tackling the three key challenges of 20nm processes: design complexity; the physics of lithography; and economics.