Blog Topics

May 13, 2014

Mentor targets 10X cut in reliability test for power electronics

New MicReD power tester identifies failure causes without the need for post-test lab analysis
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April 28, 2014

Synopsys speeds HAPS prototyping with ProtoCompiler

HAPS-specific enhancements to Synplify and Certify join next gen partitioning and planning in suite that claims 3X boost in time-to-prototype
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April 24, 2014

Altera finds a way to cheaper floating point in FPGAs

Altera has revealed that the DSP blocks in the Arria 10 FPGAs contain the logic needed to make them work as IEEE754-compliant floating-point units.
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April 22, 2014

Cadence to expand formal portfolio with Jasper buy

Cadence Design Systems has reached an agreement with Jasper Design Automation to buy the formal-verification specialist for $170m in cash.
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April 16, 2014

FinFET variability issues challenge advantages of new process

Managing finFET variability issues without extending design times is key to extracting the most from the new processes, key players told a panel at the recent SNUG meeting in Santa Clara.
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April 16, 2014

Verification perspectives: the growth of emulation

The first in a series of articles on how various vendors are addressing the flow's most challenging task looks at Mentor's strategy for emulation.
April 15, 2014

Common Platform foundry alliance to be wound down

But some research and process collaboration is set to continue in the background as Samsung, GlobalFoundries and IBM chart their own priorities.
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April 10, 2014

Mentor builds simulation-emulation bridge to ‘Verification 3.0’

Enterprise Verification Platform adds cross-over SystemVerilog, UVM, and UPF support for Veloce alongside new hardware and software debuggers.
April 8, 2014

ARM moves to open-source compiler

ARM has decided to shift from using its in-house compiler technology to the open-source combination of Clang and LLVM.
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April 7, 2014

Latest ITRS underlines slowdown in interconnect and IC scaling

The 2013 edition of the International Technology Roadmap for Semiconductors has been published. The latest set of tables underlines the slowdown in some aspects of scaling, particularly when it comes to metal interconnect.
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